The ITk global engineering effort, coordinated by two convenors (A. Catinaccio, G. Wiehhauser)

•  Integrated model and envelopes
•  Overall ITk support structure
•  Pixel global support
•  Barrel strips global support
•  Endcap strips global support
•  Thermal enclosure design
•  Surface assembly and installation
•  Access scenarios
•  Failure management
•  Material for Simulation
•  Positioning Requirements
•  Common standards
•  Internal services
•  PP1 and TE feed-troughs