LHCb RICH HPD

• PH-ED: readout electronics design and development, readout chip production and bump-bonding testing;
• PH-MIC: bump-bonding organization and coordination with ALICE ITS;
• PH-DT-DI: clean room infrastructure (SDF) support for wafer and bump-bonded assembly probing;
• PH-DT-TP: laboratory support for quantum efficiency measurements;
• TS-MME: support for vacuum bake-out tests and related metallurgy studies;
• TS-DEM: support for PCB fabrication and gold electroplating of ceramic carrier.