Bond Lab
BONDING Laboratory
- Our Laboratory provides Wire Bonding services to any CERN related experiment or project and also to non CERN ones.
- We also provide assistance in designing detector modules wich regards bonding issues as well as in designing and construction of bonding jigs (support tooling).
- We provide basic gluing facilities and assistance in gluing of read-out chips and detectors. For all jobs, please fill the Work Request Form (MS Word,PDF), print it and bring it to the bond lab.
- The handling of irradiated, radioactive or potentially hazardous components has to follow special procedures, so please fill the Work Request Form Appendix A “Radioactive Material”(MS Word,PDF).
What is wirebonding?
What types of wirebonding processes exist?
| Wirebonding processes | Pressure | Temperature | Ultrasonic energy | Wire | Pad |
| THERMOCOMPRESSION | High | 300-500 oC | No | Au | Al, Au |
| ULTRASONIC | Low | 25 oC | Yes | Au, Al | Au, Al |
| THERMOSONIC | Low | 100-150 oC | Yes | Au | Au, Al |
Alternatives to wire bonding
Tape Automated Bonding (TAB)
Flip chip bonding
bump bonding
- Currently the Bondlab is performing exclusively Ultrasonic Wedge Bonding with Aluminum wires.