Wire Bonding Lab (BONDLAB)

Contact Person

CERN EP/DT BONDLAB

 The EP-DT BONDLAB provides Al Wedge Wire Bonding services to all CERN related projects.
The team provides guidance and support in the layout of detector modules and their components with particular regard to wire bonding issues, as well as in the design and construction of wire bonding support tooling. 
The team constantly shares information about issues, solutions and bond system optimization within the CERN community and external institutes in the common effort of finding solutions to the new challenges within the HEP community such as decreasing pitch and higher density inter connectivity. 
 

Glue dispensing robot, I&J Fisnar 7300
Die bonder, CAMMAX DB 600
Automatic Wire Bonder DELVOTEC 640